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DOI
Author
Journal
Affiliation
ISSN
Subject
Effect of Bismuth Addition on Structure and Mechanical Properties of Tin-9Zinc Soldering Alloy
(Articles)
Muhommad Abdul Wadud
,
M. A. Gafur
,
Md. Rakibul Qadir
,
Mohammad Obaidur Rahman
Materials Sciences and Applications
Vol.6 No.9
,September 16, 2015
DOI:
10.4236/msa.2015.69081
2,731
Downloads
4,203
Views
Citations
Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys
(Articles)
M. A. Wadud
,
M. A. Gafur
,
M. R. Qadir
,
M. O. Rahman
Materials Sciences and Applications
Vol.6 No.11
,November 20, 2015
DOI:
10.4236/msa.2015.611100
3,549
Downloads
5,086
Views
Citations
Changing the Growth Behavior of a NiSn-Solder Using Gold
(Articles)
Mathias Wendt
,
Andreas Weimar
,
Marcus Zenger
,
Klaus Dilger
Journal of Materials Science and Chemical Engineering
Vol.4 No.4
,April 28, 2016
DOI:
10.4236/msce.2016.44004
2,249
Downloads
3,179
Views
Citations
Effect of Strain Rate on Tensile Behavior of Sn-9Zn-xAg-ySb; {(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} Lead-Free Solder Alloys
(Articles)
Shihab Uddin
,
Md. Abdul Gafur
,
Mohammad Obaidur Rahman
Materials Sciences and Applications
Vol.14 No.4
,April 13, 2023
DOI:
10.4236/msa.2023.144016
84
Downloads
327
Views
Citations
Structure and Properties of Sn-9Zn Lead-Free Solder Alloy with Heat Treatment
(Articles)
Mahmoud Hammam
,
Fardos Saad Allah
,
El Said Gouda
,
Yaser El Gendy
,
Heba Abdel Aziz
Engineering
Vol.2 No.3
,April 13, 2010
DOI:
10.4236/eng.2010.23024
6,815
Downloads
11,904
Views
Citations
Effect of Antimony Additions on Corrosion and Mechanical Properties of Sn-Bi Eutectic Lead-Free Solder Alloy
(Articles)
Alberto Torres
,
Luis Hernández
,
Octavio Domínguez
Materials Sciences and Applications
Vol.3 No.6
,June 18, 2012
DOI:
10.4236/msa.2012.36051
10,059
Downloads
14,210
Views
Citations
Effects of LiF on the Structure and Electrical Properties of (Na
0.52
K
0.435
Li
0.045
)Nb
0.87
Sb
0.08
Ta
0.05
O
3
Lead-Free Piezoelectric Ceramics Sintered at Low Temperatures
(Articles)
P. D. Gio
,
N. D. Phong
Journal of Materials Science and Chemical Engineering
Vol.3 No.11
,November 16, 2015
DOI:
10.4236/msce.2015.311003
6,024
Downloads
6,978
Views
Citations
Structural and Dielectric Properties of Sn Doped Barium Magnesuim Zirconium Titanate Perovskite Ceramics
(Articles)
Sankararao Gattu
,
Kamala Sujani Dasari
,
Venkata Ramesh Kocharlakota
World Journal of Condensed Matter Physics
Vol.5 No.4
,November 30, 2015
DOI:
10.4236/wjcmp.2015.54035
4,325
Downloads
5,896
Views
Citations
Enhanced Ferroelectric and Converse Piezoelectric Properties of Dense Lead-Free Na
0.4
K
0.1
Bi
0.5
TiO
3
Ceramics for Actuator Applications
(Articles)
N. Shara Sowmya
,
Pravin Varade
,
Narayanan Venkataramani
,
Ajit R. Kulkarni
Advances in Materials Physics and Chemistry
Vol.9 No.1
,March 12, 2019
DOI:
10.4236/ampc.2019.91001
848
Downloads
2,317
Views
Citations
Effect of Zr on Structural and Dielectrical Properties of (Ba
0.9
Mg
1.0
)(Zr
x
Ti
1-x
)O
3
Ceramics
(Articles)
Sankararao Gattu
,
Venuturupalli Durga Prasadu
,
Kocharlakota Venkata Ramesh
Advances in Materials Physics and Chemistry
Vol.5 No.10
,October 21, 2015
DOI:
10.4236/ampc.2015.510042
4,438
Downloads
5,559
Views
Citations
Investigation of the Influence of Annealing Temperature on the Morphology and Growth Kinetic of Ni3Sn4 in the Ni-Sn-Solder System
(Articles)
Mathias Wendt
,
Andreas Plöβl
,
Andreas Weimar
,
Marcus Zenger
,
Klaus Dilger
Journal of Materials Science and Chemical Engineering
Vol.4 No.2
,February 29, 2016
DOI:
10.4236/msce.2016.42013
2,827
Downloads
3,952
Views
Citations
Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element
(Articles)
E. A. Eid
,
Manal A. Ramadan
,
A. B. El Basaty
Engineering
Vol.10 No.1
,January 31, 2018
DOI:
10.4236/eng.2018.101003
937
Downloads
2,486
Views
Citations
A Review of the Study on the Electromigration and Power Electronics
(Articles)
Md. Khalilur Rahman
,
Abul Monsur Mohammed Musa
,
Budrun Neher
,
Kawchar Ahmed Patwary
,
Mohammad Atiqur Rahman
,
Md. Shariful Islam
Journal of Electronics Cooling and Thermal Control
Vol.6 No.1
,March 30, 2016
DOI:
10.4236/jectc.2016.61002
3,613
Downloads
6,326
Views
Citations
Evaluation of Fatigue Life of Semiconductor Power Device by Power Cycle Test and Thermal Cycle Test Using Finite Element Analysis
(Articles)
Kazunori Shinohara
,
Qiang Yu
Engineering
Vol.2 No.12
,January 10, 2011
DOI:
10.4236/eng.2010.212127
9,398
Downloads
15,730
Views
Citations
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