Effect of Bismuth Addition on Structure and Mechanical Properties of Tin-9Zinc Soldering Alloy

Muhommad Abdul Wadud¹, M. A. Gafur^2*, Md. Rakibul Qadir², Mohammad Obaidur Rahman¹

¹Department of Physics, Jahangirnagar University, Savar, Bangladesh.
²PP&PDC, BCSIR, Dhaka, Bangladesh.

DOI: 10.4236/msa.2015.69081                

Abstract

Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their microhardness and mechanical properties. Microhardness, tensile strength and elastic modulus increase with Bi addition while ductility decreases with Bi addition.

Keywords

Lead Free Solder Alloy, Eutectic Alloy, Microhardness

Conflicts of Interest

The authors declare no conflicts of interest.

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