• Techno-Economic and Sustainability Analysis of Potential Cooling Methods in Irish Data Centres ()
  Lee Gibbons, Tim Persoons, Sajad Alimohammadi
  Journal of Electronics Cooling and Thermal Control Vol.10 No.3,  August 4, 2021
  DOI: 10.4236/jectc.2021.103003  142 Downloads   787 Views   Citations
  This article belongs to the Special Issue on

• Best Practices for Thermal Modeling in Microelectronics with Natural Convection Cooling: Sensitivity Analysis ()
  Mamadou Kabirou Touré, Papa Momar Souaré, Julien Sylvestre
  Journal of Electronics Cooling and Thermal Control Vol.10 No.2,  May 18, 2021
  DOI: 10.4236/jectc.2021.102002  173 Downloads   877 Views   Citations
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• New Measurement Method for Direct Cooled Power Electronic with Transmission Fluids ()
  Andreas Griesinger, Christian Windel, Yungwan Kwak, Arthur Petuchow
  Journal of Electronics Cooling and Thermal Control Vol.10 No.1,  March 31, 2021
  DOI: 10.4236/jectc.2021.101001  200 Downloads   778 Views   Citations
  This article belongs to the Special Issue on

• Optimal Thermal Insulation Thickness in Isolated Air-Conditioned Buildings and Economic Analysis ()
  Mousa M. Mohamed
  Journal of Electronics Cooling and Thermal Control Vol.9 No.2,  June 19, 2020
  DOI: 10.4236/jectc.2020.92002  519 Downloads   1,438 Views   Citations
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• Modeling of Subcooled Boiling Heat Transfer to Cool Electronic Components in a Micro-Channel ()
  Hasan Abbasinejad, Reza Hoseini Abardeh
  Journal of Electronics Cooling and Thermal Control Vol.9 No.1,  March 31, 2020
  DOI: 10.4236/jectc.2020.91001  415 Downloads   1,146 Views   Citations
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• Formula of Thermogradient Effect ()
  Zviad Kovziridze
  Journal of Electronics Cooling and Thermal Control Vol.8 No.4,  December 28, 2018
  DOI: 10.4236/jectc.2018.84004  578 Downloads   1,051 Views   Citations
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• Failure Stress Energy Formula ()
  Zviad Kovziridze
  Journal of Electronics Cooling and Thermal Control Vol.8 No.3,  September 28, 2018
  DOI: 10.4236/jectc.2018.83003  565 Downloads   1,070 Views   Citations
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• Investigation and Comparison of the DIBL Parameter and Thermal Effects of SOD Transistors and SOI Transistors and Improving Them with the Change of Their BOX Thicknesses ()
  Nooshien Laderian, Arash Daghighi
  Journal of Electronics Cooling and Thermal Control Vol.8 No.2,  June 29, 2018
  DOI: 10.4236/jectc.2018.82002  665 Downloads   1,481 Views   Citations
  This article belongs to the Special Issue on

• Proposal of Functional Thermal Control Systems for High-Power Micro-Satellite and Its Demonstration under Thermal Vacuum Condition ()
  Ai Ueno, Kohei Yamada, Kikuko Miyata, Hosei Nagano
  Journal of Electronics Cooling and Thermal Control Vol.8 No.1,  March 30, 2018
  DOI: 10.4236/jectc.2018.81001  1,989 Downloads   3,184 Views   Citations
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• Multi-Physics Numerical Simulation of Thermoelectric Devices ()
  Ibrahim M. Abdel-Motaleb, Syed M. Qadri
  Journal of Electronics Cooling and Thermal Control Vol.7 No.4,  December 28, 2017
  DOI: 10.4236/jectc.2017.74010  1,281 Downloads   2,837 Views   Citations
  This article belongs to the Special Issue on