Effect of Antimony Additions on Corrosion and Mechanical Properties of Sn-Bi Eutectic Lead-Free Solder Alloy

DOI: 10.4236/msa.2012.36051   PDF   HTML     8,538 Downloads   12,067 Views   Citations

Abstract

The goal of the present work is to investigate the effects of the addition of Sb (0, 3 and 6 wt%) on structure, melting, corrosion and mechanical properties of Sn-Bi eutectic solder alloys. The mechanical properties of the bulk Sn-Bi-Sb solders were higher as the amount of antimony increases, making compressive strength augment from 65 MPa to 100 MPa when 6 wt% Sb was incorporated to the Sn-Bi eutectic alloy. The three alloys presented a melting temperature that is smaller to the one exhibited by the eutectic alloy Sn-38Pb (Tm = 183°C). According to the electrochemical results, the addition of higher contents of Sb to the Sn-Bi eutectic alloy had a positive effect: it ennobled the Ecorr values.

Share and Cite:

A. Torres, L. Hernández and O. Domínguez, "Effect of Antimony Additions on Corrosion and Mechanical Properties of Sn-Bi Eutectic Lead-Free Solder Alloy," Materials Sciences and Applications, Vol. 3 No. 6, 2012, pp. 355-362. doi: 10.4236/msa.2012.36051.

Conflicts of Interest

The authors declare no conflicts of interest.

References

[1] K. Suganuma and K. Kim, “Sn-Zn Low Temperature Solders,” Journal of Materials Science: Materials for Electronics, Vol. 18, No. 1-3, 2007, pp. 121-127. doi:10.1007/s10854-006-9018-2
[2] K. N. Subramanian and J. G. Lee, “Physical Metallurgy in Lead-Free Electronic Solder Development,” JOM Journal of the Minerals, Metals and Materials Society, Vol. 55, No. 5, 2003, pp. 26-32. doi:10.1007/s11837-003-0242-4
[3] J. Glazer, “Metallurgy of Low Temperature Pb-Free Solders for Electronic Assembly,” International Materials Review, Vol. 40, No. 2, 1995, pp. 65-93. doi:10.1179/095066095790151115
[4] L. Duan, D. Q. Yu, S. Q. Han, H. T. Ma and L. Wang, “Microstructural Evolution of Sn-9Zn-3Bi Solder/Cu Joint during Long-Term Aging at 170°C,” Journal of Alloys and Compounds, Vol. 381, No. 1-2, 2004, pp. 202-207. doi:10.1016/j.jallcom.2004.03.124
[5] C. W. Hwang and K. Suganuma, “Joint Reliability and High Temperature Stability of Sn-Ag-Bi Lead-Free Solder with Cu and Sn-Pb/Ni/Cu Substrates,” Materials Science and Engineering, Vol. 373, No. 1-2, 2004, pp. 187-194. doi:10.1016/j.msea.2004.01.019
[6] H. L. Lai and J. G. Duh, “Lead-Free Sn-Ag and Sn-Ag-Bi Solder Powders Prepared by Mechanical Alloying,” Journal of Electronic Materials, Vol. 32, No. 4, 2003, pp. 215-220. doi:10.1007/s11664-003-0212-1
[7] H. W. Miao and J. G. Duh, “Microstructural Evolution in Sn-Bi and Sn-Bi-Cu Solder Joints Under Thermal Aging,” Materials Chemistry and Physics, Vol. 71, No. 3, 2001, pp. 255-271. doi:10.1016/S0254-0584(01)00298-X
[8] M. Mori, K. Miura, T. Sasaki and T. Ohtsuka, “The Corrosion of Tin Alloys in Sulfuric and Nitric Acids,” Corrosion Science, Vol. 44, No. 4, 2002, pp. 887-898. doi:10.1016/S0010-938X(01)00094-4
[9] W. R. Osorio, L. R. Garcia, L. C. Peixoto and A. Garcia, “Electrochemical Behavior of Lead-Free Snag Solder Alloy Affected by the Microstructure,” Materials and Design, Vol. 32, No. 10, 2011, pp. 4763-4772. doi:10.1016/j.matdes.2011.06.032
[10] D. Li, P. P. Conway and C. Liu, “Corrosion Characterization of Tin-Lead and Lead-Free Solders in 3.5 wt% NaCl Solution,” Corrosion Science, Vol. 50, No. 4, 2008, pp. 995-1004. doi:10.1016/j.corsci.2007.11.025
[11] M. Dighe, “Corrosion of Materials,” ASM International, Materials Park, 2005.
[12] H. Okamoto, “Desk Handbook: Phase Diagrams for Binary Alloys,” 2nd Edition, ASM International, Materials Park, 2010
[13] J. D. Verhoeven, “Fundamentals of Physical Metallurgy,” John Wiley & Sons, New York, 1989.
[14] J. A. Dantzing and M. Rappaz, “Solidification,” CRC Press, London, 2009.
[15] R. W. Cahn and P. Haasen, “Physical Metallurgy,” 4th Edition, North-Holland Publishing Company, Amsterdam, 1996.
[16] W. Kurz and D. J. Fisher, “Fundamentals of Solidification,” 4th Edition, Trans Tech Publications, Zurich, 1998.
[17] G. Humpston and D. M. Jacobson, “Principles of Soldering and Brazing,” ASM International, Materials Park, 1993.
[18] R. Chang and J. Overby, “General Chemistry,” 6th Edition, McGraw-Hill, New York, 2010.

  
comments powered by Disqus

Copyright © 2020 by authors and Scientific Research Publishing Inc.

Creative Commons License

This work and the related PDF file are licensed under a Creative Commons Attribution 4.0 International License.