Thermal Modeling of Thermosyphon Integrated Heat Sink for CPU Cooling
A. Shanmuga Sundaram, Anirudh Bhaskaran
DOI: 10.4236/jectc.2011.12002   PDF    HTML     7,571 Downloads   16,767 Views   Citations


A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling. An Indirect cooling module has been experimentally studied and analyzed under steady state condition for both natural and forced convection. The thermal model is employed to determine the actual heat transfer and the effectiveness of the present model and compared it with the conventional cooling method and found that there is an appreciable improvement in the present model.

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Sundaram, A. and Bhaskaran, A. (2011) Thermal Modeling of Thermosyphon Integrated Heat Sink for CPU Cooling. Journal of Electronics Cooling and Thermal Control, 1, 15-21. doi: 10.4236/jectc.2011.12002.

Conflicts of Interest

The authors declare no conflicts of interest.


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