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B. N. Smirnov and M. L. Khazin, “Fol’ga Dlya Pechatnyh Plat/Foil for Printed Circuit Boards,” UB of RAS, Ekaterinburg, 2003, p. 376.
has been cited by the following article:
TITLE: Mechanical Properties of Micro- and Nanostructured Copper Films
AUTHORS: N. Kosarev, M. Khazin, R. Apakashev, N. Valiev
KEYWORDS: Nano- and Microcrystalline Materials; Hall-Petch Relation; Yield Point Stress; Grain Boundary Hardening Coefficient; Nonequilibrium Grain Boundaries
JOURNAL NAME: Journal of Materials Science and Chemical Engineering, Vol.1 No.5, November 7, 2013
ABSTRACT: Mechanical properties of electrodeposited and electroless copper with nano- and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account the grain boundary hardening and density of dislocation.
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