B. N. Smirnov and M. L. Khazin, “Fol’ga Dlya Pechatnyh Plat/Foil for Printed Circuit Boards,” UB of RAS, Ekaterinburg, 2003, p. 376.

has been cited by the following article:

• TITLE: Mechanical Properties of Micro- and Nanostructured Copper Films

  AUTHORS: N. Kosarev, M. Khazin, R. Apakashev, N. Valiev

  KEYWORDS: Nano- and Microcrystalline Materials; Hall-Petch Relation; Yield Point Stress; Grain Boundary Hardening Coefficient; Nonequilibrium Grain Boundaries

  JOURNAL NAME: Journal of Materials Science and Chemical Engineering, Vol.1 No.5, November 7, 2013

  ABSTRACT: Mechanical properties of electrodeposited and electroless copper with nano- and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account the grain boundary hardening and density of dislocation.