Kerns, J.A., Colella, N.J., Makowiecki, D. and Davidson, H.L. (1995) Copper-Diamond Composite Substrates for Electronic Components. Proceedings of 28th International Symposium on Microelectronics, 28-37.

has been cited by the following article:

• TITLE: Effect of Boron Addition on the Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix Composites Fabricated by SPS

  AUTHORS: Kiyoshi Mizuuchi, Kanryu Inoue, Yasuyuki Agari, Motohiro Tanaka, Takashi Takeuchi, Jun-ichi Tani, Masakazu Kawahara, Yukio Makino, Mikio Ito

  KEYWORDS: Thermal Conductivity, Spark Plasma Sintering, Copper, Diamond, Composite

  JOURNAL NAME: Journal of Materials Science and Chemical Engineering, Vol.4 No.9, September 7, 2016

  ABSTRACT: Diamond particle dispersed copper (Cu) matrix composites were fabricated from the powder mixture composed of diamond, pure-Cu and boron (B) by spark plasma sintering (SPS). The composites were consolidated at 1173 K for 600 s by SPS. The reaction between the diamond particle and the Cu matrix in the composite was not confirmed by SEM observation and X-ray diffraction (XRD) analysis. The relative packing density of the Cu/diamond composites increased with B addition and attained 93.2% - 95.8% at the B content range between 1.8 vol.% and 13.8 vol.%. The thermal conductivity of the diamond-dispersed Cu composite drastically increased with B addition and reached the maximum value of 689 W/mK at 7.2 vol% B. Numerous transgranular fractures of diamond particles were observed on bending fracture surfaces of Cu-B/diamond composites. This indicates strong bonding between the diamond particle and the Cu matrix in the composite. The coefficient of thermal expansion of the composite falls in the upper line of Kerner’s model.