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Arnaud, L., Tartavel, G., Berger, T., Mariolle, D., Gobil, Y. and Touet, I. (2000) Microstructure and Electromigration in Copper Damascene Lines. Microelectronics Reliability, 40, 77-86.
http://dx.doi.org/10.1016/S0026-2714(99)00209-7

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