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A spatiotemporal signal processing technique for wafer-scale IC thermomechanical stress monitoring by an infrared camera

DOI: 10.4236/jbm.2013.12001    2,746 Downloads   6,492 Views  

ABSTRACT

In this paper, we describe a new silicon-die thermal monitoring approach using spatiotemporal signal processing technique for Wafer-Scale IC thermome- chanical stress monitoring. It is proposed in the context of a wafer-scale-based (WaferICTM) rapid prototyping platform for electronic systems. This technique will be embedded into the structure of the WaferIC, and will be used as a preventive measure to protect the wafer from possible damages that can be caused by excessive thermomechanical stress. The paper also presents spatial and spatiotemporal algorithms and the experimental results from an IR images collection campaign conducted using an IR camera.

Conflicts of Interest

The authors declare no conflicts of interest.

Cite this paper

Saydé, M. , Lakhssassi, A. , Kengne, E. and Palenichka, R. (2013) A spatiotemporal signal processing technique for wafer-scale IC thermomechanical stress monitoring by an infrared camera. Journal of Biosciences and Medicines, 1, 1-5. doi: 10.4236/jbm.2013.12001.

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