10 Gb/s Optical Interconnection on Flexible Optical Waveguide in Electronic Printed Circuit Board


In this paper, we proposed 10 Gb/s transmission using 4-channel polymer waveguides on the optical electronic printed circuit board. It was simulated by the ray tracing method for tolerance study of optical interconnection and fabrication. In order for easy fabrication and high position accuracy, the polymer waveguides were forming silver coated 45° reflective mirrors by dicing method and e-beam deposition for 90° light beam turning. The coupling loss was demonstrated in different polishing grit sizes. The optical interconnection in board-embed 4-channel flexible waveguides was demonstrated with a low propagation loss of 0.1 dB/cm and a clear eye diagram at 2.5 Gb/s data rate per channel.

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S. Hsu, C. Tsou, C. Wang and S. Tseng, "10 Gb/s Optical Interconnection on Flexible Optical Waveguide in Electronic Printed Circuit Board," Optics and Photonics Journal, Vol. 3 No. 2B, 2013, pp. 252-255. doi: 10.4236/opj.2013.32B059.

Conflicts of Interest

The authors declare no conflicts of interest.


[1] S. Uhlig and M. Robertsson, “Limitations to and Solutions for Optical Loss in Optical Backplanes,” Journal of Lightwave Technology, Vol. 24, 2006,pp. 1710-1724. doi:10.1109/JLT.2006.870978
[2] D. A. B. Miller, “Rationale and Challenges for Optical Interconnects to Electronic Chips,” Proceedings of the IEEE, Vol. 88, 2000, pp. 728-749. doi:10.1109/5.867687
[3] B. S. Rho, W. J. Lee, J. W. Lim, G. W. Kim, C. H. Cho, and S. H. Hwang, “High-Reliability Flexible Optical Printed Circuit Board for Opto-Electric Interconnections,” Optical Engineering, Vol. 48, 2009.
[4] T. Shibata and A. Takahashi, “Flexible Opto-Electronic Circuit Board for In-Device Interconnection,” Lake Buena Vista, FL, 2008, pp. 261-267.
[5] S. H. Hwang, M. H. Cho, S. K. Kang, H. H. Park, H. S. Cho, S. H. Kim, K. U. Shin and S. W. Ha, “Passively Assembled Optical Interconnection System Based on An Optical Printed-Circuit Board,” IEEE Photonics Technology Letters, Vol. 18, 2006 pp. 652-654. doi:10.1109/LPT.2006.870127
[6] E. Bosman, J. Missinne, B. V. Hoe, G. V. Steenberge, S. Kalathimekkad, J. V. Erps, I. Milenkov, K. Panajotov, T. V. Gijseghem, P. Dubruel, H. Thienpont and P. V. Daele, “Ultrathin Optoelectronic Device Packaging in Flexible Carriers,” IEEE Journal on Selected Topics in Quantum Electronics, Vol. 17, 2011, pp. 617-628. doi:10.1109/JSTQE.2010.2096407
[7] M. Karppinen, T. Alajoki, A. Tanskanen, K. Kataja, J. T. Mäkinen, P. Karioja, M. Immonen and J. Kivilahti, “Parallel Optical Interconnect between Surface-Mounted Devices on FR4 Printed Wiring Board Using Embedded Waveguides and Passive Optical Alignments,” Strasbourg, 2006.

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