Numerical Analysis of Printed Circuit Board with Thermal Vias: Heat Transfer Characteristics under Nonisothermal Boundary Conditions

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ISSN Print: 2162-6162
ISSN Online: 2162-6170
www.scirp.org/journal/jectc
E-mail: jectc@scirp.org

"Numerical Analysis of Printed Circuit Board with Thermal Vias: Heat Transfer Characteristics under Nonisothermal Boundary Conditions"
written by Yasushi Koito, Yoshihiro Kubo, Toshio Tomimura,
published by Journal of Electronics Cooling and Thermal Control, Vol.3 No.4, 2013

has been cited by the following article(s):

[1]	Modelado y análisis térmico de semiconductores de potencia para la reconfiguración dinámica de módulos fotovoltaicos.
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[2]	Thermal modeling and design optimization of PCB vias and pads
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[3]	Thermal Modeling and Sizing of PCB Copper Pads
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[4]	Numerical Study on Heat Transfer Characteristics of Heated/Cooled Rods Having a Composite Board in between: Effect of Thermal Vias
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[5]	자동차용 Head Up Display 의 LED 방열시스템 최적화에 관한 연구
	KSAE 2017 Annual Spring Conference, 2017

[6]	Modelação térmica de placas de circuito impresso
	2014

[1]	Thermal Modeling and Design Optimization of PCB Vias and Pads IEEE Transactions on Power Electronics, 2020 DOI:10.1109/TPEL.2019.2915029

[2]	Thermal Modeling and Sizing of PCB Copper Pads 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 2018 DOI:10.1109/ECCE.2018.8558128

[3]	Numerical Study on Heat Transfer Characteristics of Heated/Cooled Rods Having a Composite Board in between: Effect of Thermal Vias Journal of Electronics Cooling and Thermal Control, 2017 DOI:10.4236/jectc.2017.74008

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