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SCIENTIA SINICA Chimica,
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2023
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2023
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Integrated Circuit Fabrication
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Influence of artificial exchange current density on microstructure of Ni films by pulse-reverse electroplating
Materials Chemistry and Physics,
2022
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Effect of tin dioxide sol on the peculiarities of electrodeposition and structure of copper and nickel coatings
Surfaces and Interfaces,
2022
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Influence of artificial exchange current density on microstructure of Ni films by pulse-reverse electroplating
Materials Chemistry and Physics,
2022
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Effect of tin dioxide sol on the peculiarities of electrodeposition and structure of copper and nickel coatings
Surfaces and Interfaces,
2022
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Three-Dimesnional Semicondoctor Stacking using TSV(Through-Si-Via) Technology
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2021
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