Prof. Li Junhui
School of Mechanical and
Electronical Engineering
Central South University, China
Email: lijunhui@csu.edu.cn
Qualifications
2003–2008 Ph.D., Central South University, China
2000–2003 M.Eng., Central South University, China
1988–1992 B.Eng., Central South University, China
Publications
(Selected)
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Li Junhui, Zhang Xiaolong, Liu Linggang, and Han Lei, “Interfacial
Characteristics and Dynamic Process of Au- and Cu-Wire Bonding and Overhang
Bonding in Microelectronics Packaging”, IEEE/ASME Journal of
Microelectromechanical Systems, Vol.22, No.3, Jun, 2013, Pages 560-568.
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Gen Chen, Fashen Chen, Xiaohe
Liu, Wei Ma, Hongmei Luo, Junhui Li٭, Renzhi Ma, Guanzhou Qiu, “Hollow
spherical rare-earth-doped yttrium oxysulfate: a novel structure for
upconversion”, Nano Research, Vol.7, No.8, 2014, Pages 1093-1102.
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J. Li, L. Han, J. Duan, J. Zhong, “Interface
mechanism of ultrasonic flip chip bonding”, Applied Physics Letters, Vol.90,
2007, Pages 242902.
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Li Junhui, Deng Luhua, Ma Bangke,
and Han Lei, “Investigation of the characteristics of overhang bonding for
3-D stacked dies in microelectronics packaging”, Microelectronics Reliability,
Vol.51, 2011, Pages 2236-2242.
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Junhui Li, Bangke Ma, Ruishan
Wang, “Study on A Cooling System Based on Thermoelectric Cooler for
Thermal Management of High-power LEDs”, Microelectronics Reliability, Vol.51,
2011, Pages 2210-2215.
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Junhui Li, Liu Linggang, Deng
Luhua, Ma Bangke, Wang Fuliang, Lei Han, “Interfacial microstructures and
thermodynamics of thermosonic Cu-wire bonding”, IEEE Electron Device Letters,
Vol. 32, No.10, 2011, Pages 1433-1435.
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Junhui Li, Liu Linggang, Ma Bangke,
Deng Luhua, Lei Han, “Dynamics Features of Cu-Wire Bonding During Overhang
Bonding Process”, IEEE Electron Device Letters, Vol. 32, No. 12,
2011, Pages 1731-1733.
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Li Jun-Hui, Wang Ruishan, Han
Lei, Wang Fuliang, Long Zhili, “HRTEM And X-Ray Diffraction Anylsis Of Au
Wire Bonding Interface In Microelectronics Packaging”, Solid State
Sciences,Vol. 13, 2011, Pages 72-76.
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Junhui Li, Wang Fuliang, Lei Han
and Jue Zhong, “Theoretical and Experimental Analyses of Atom Diffusion
Characteristics on Wire Bonding Interfaces”, Journal of Physics D: Applied
Physics, Vol. 41, 2008, Pages 135303.
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Junhui Li, Lei Han, Jue Zhong, “Observations
on HRTEM features of thermosonic flip chip bonding interface”, Materials
Chemistry and Physics, Vol. 106, No.2-3, 2007, Pages 457-460.
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Li Junhui, Wang Ruishan, He Hu,
Wang Fuliang, Han Lei, Zhong Jue, The Law of Ultrasonic Energy Conversion in
Thermosonic Flip Chip Bonding Interface, Microelectronic Engineering, Vol. 86,
2009, Pages 2063-2066.
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Junhui Li, Lei Han, Jue Zhong, “Power
and Interface Features of Thermosonic Flip Chip Bonding”, IEEE Transactions on
Advanced Packaging, Vol. 30, No. 3, 2008, Pages 442-446.
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Li Jun-Hui, Duan Ji-an, Han Lei,
Zhong Jue, “Microstructural characteristics of Au/Al bonded interfaces”,
Materials Characterization, Vol. 58, 2007, Pages 103-107.
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Junhui Li, Lei Han, Jue Zhong, “Short-Circuit
Diffusion of Ultrasonic Bonding Interfaces in Microelectronic Packaging”,
Surface and Interface Analysis, Vol. 40, No.5, 2008, Pages 953-957.
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Li Junhui, Zhang Xiaolong, Liu
Linggang, Deng Luhua, and Han Lei, “Effects of Ultrasonic Power and Time
on Bonding Strength and Interfacial Atomic Diffusion During Thermosonic
Flip-Chip Bonding”, IEEE Transation on Components, Packaging and Manufacturing
Technology, Vol. 2, No. 3, 2012, Pages 521-526.