Journal of Electronics Cooling and Thermal Control

Journal of Electronics Cooling and Thermal Control

ISSN Print: 2162-6162
ISSN Online: 2162-6170
www.scirp.org/journal/jectc
E-mail: jectc@scirp.org
"Experimental Study of Jet Nanofluids Impingement System for Cooling Computer Processing Unit"
written by Paisarn Naphon, Somchai Wongwises,
published by Journal of Electronics Cooling and Thermal Control, Vol.1 No.3, 2011
has been cited by the following article(s):
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[19] Heat transfer and airflow characteristics enhancement of compact plate-pin fins heat sinks–a review
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[22] Author's Declaration
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[23] Experimental study of using γ-Al2O3–water nanofluid flow through aluminum foam heat sink: comparison with numerical approach
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[26] Design Optimisation and Analysis of Heat Sinks for Electronic Cooling
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[27] Chemical Engineering and Processing: process Intensification Experimental investigation of heat transfer characteristics of the hot surface using Al2O3 e …
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[29] Experimental investigation of heat transfer characteristics of the hot surface using Al 2 O 3–water nanofluids
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[31] Heat transfer performance of Cu–water nanofluids in the jet arrays impingement cooling system
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[32] A Numerical Investigation of Impinging-Jet Cooling with Nanofluids
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[34] An experimental investigation on the impingement of a planar jet of Al2O3–water nanofluid on a V-shaped plate
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[37] Effect of Non-Condensable Gas Leakage on Long Term Cooling Performance of Loop Thermosyphon
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