TITLE:
Reconfigurable Digital Circuits Based on Chip Expander with Integrated Temperature Regulation
AUTHORS:
Vaclav Simek, Richard Ruzicka, Adam Crha, Michal Reznicek
KEYWORDS:
Reconfiguration, Digital Circuits, Polymorphic Electronics, Chip Expander, Thick Film, Wirebonding
JOURNAL NAME:
Journal of Computer and Communications,
Vol.3 No.11,
November
19,
2015
ABSTRACT: This article is dealing with a
development of custom chip expander platform with the possibility of accurate
temperature control and integration of additional silicon-based features. Such
platform may serve as a useful tool which facilitates the burdens connected
with measurement and analysis tasks of experimental semiconductor structures.
The devised solution provides the functionality of carrier substrate (Al2O3 compound) with CTE compatibility to the experimental silicon chip and is fully
customizable with respect to a particular chip. It also allows achieving an
easy fan-out of small-diameter chip terminals into a larger, more convenient
area and placement of chip specimens conveniently into space-constrained
chamber of the AFM microscopes, probe stations, etc. Real application of the
developed chip expander platform is demonstrated in context of digital reconfigurable
circuits based on polymorphic electronics. In this case the chip expander with
attached polymorphic chip REPOMO is thermally stabilized at an ambient
temperature level up to approximately 135。C and its sensitivity to this
phenomenon is demonstrated.