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S. Li, K. W. Gao, L. J. Qiao, F. X. Zhou and W. Y. Chu, “Molecular Dynamics Simulation of Microcrack Healing in Copper,” Computational Materials Science, Vol. 20, No. 2, 2001, pp. 143-150. doi:10.1016/S0927-0256(00)00130-0

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