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Xu, J., Wang, C., Wang, T., Wang, Y., Kang, Q., Liu, Y. and Tian, Y. (2018) Mechanisms for Low-Temperature Direct Bonding of Si/Si and Quartz/Quartz via VUV/O3 Activation. RSC Advances, 8, 11528-11536.
https://doi.org/10.1039/C7RA13095C

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