Dick, A.R., Bell, W.K., Luke, B., Maines, E., Mueller, B., Rawlings, B., Kohl, P.A. and Willson, C.G. (2016) High Aspect Ratio Patterning of Photosensitive Polyimide with Low Thermal Expansion Coefficient and Low Dielectric Constant. Journal of Micro/Nanolithography, MEMS, and MOEMS, 15, Article ID: 033503.
https://doi.org/10.1117/1.JMM.15.3.033503

has been cited by the following article:

• TITLE: Acidic Polyester Imides as Thermally Stable Binder Polymers for Negative-Tone Black Photoresist

  AUTHORS: Genggongwo Shi, Kyeongha Baek, Jun Bae, Lee Soon Park

  KEYWORDS: Polyester Imide, One-Pot Solution Polymerization, Black Photoresist, Photolithography

  JOURNAL NAME: Materials Sciences and Applications, Vol.11 No.4, April 13, 2020

  ABSTRACT: Polyimides are well-known for their high chemical inertness and thermal stability. However, it is usually challenging to synthesize UV-curable polyimides since the imidization reaction requires such harsh conditions that acrylate type double bonds cannot withstand. In this work, synthetic methods are developed to obtain polyester-imide type binder polymers with high thermal stability, high compatibility with the other components of the black photoresist, and fine photolithographic patterning property for the negative-tone black photoresist. The syntheses of diimide-diacid or diimide-diol intermediates for the polyesterification with dianhydride gave polyester imides which meets this requirement. The photolithographic tests have shown that the patterning of the micron-sized PDL of the organic light emitting diode (OLED) panel could be obtained. This work will interest the researchers working on the design and optimization of thermally stable binder polymers.