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https://doi.org/10.1177/0021998306069888

has been cited by the following article:

• TITLE: The Microstructure and Properties of Copper with Ceria Nanoparticles Addition

  AUTHORS: Daniela Passarelo Moura da Fonseca, Waldemar Alfredo Monteiro

  KEYWORDS: Copper-Based Composites, Ceria, Microstructure, Electrical Conductivity, Hardness

  JOURNAL NAME: Journal of Materials Science and Chemical Engineering, Vol.7 No.10, October 22, 2019

  ABSTRACT: Copper-based composites strengthened by ceria nanoparticles were processed by conventional powder metallurgy: mixing (30 min and 46 rpm), compaction (cold, uniaxial, 1080 MPa for 10 s) and sintering (800°C for 6 h in vacuum atmosphere of 10−5 torr). It was studied the microstructure (optical microscopy, scanning electron microscopy), X-ray diffraction with Rietveld refinement and some properties (electrical conductivity, Vickers hardness and fracture analysis) of the compositions 92 wt% Cu - 8 wt% CeO2 and 80 wt% Cu - 20 wt% CeO2. The results showed uniform phase distribution, low porosity and ceria disperse inside copper grain. In despite of properties, the composites had electrical conductivity of 38% IACS and 15% IACS and hardness of 69 and 88 HV5, respectively. The results of 92 wt% Cu - 8 wt% CeO2 composites were promising, and they are in according with actual literature.