Article citationsMore>>
Komatsuzaki, H., Suzuki, K., Liu, Y., Kosugi, T., Ikoma, R. and Nishioka, Y. (2011) Flexible Polyimide Micropump Fabricated Using Hot Embossing. Japanese Journal of Applied Physics, 50, 06GM09.
https://doi.org/10.1143/JJAP.50.06GM09
has been cited by the following article:
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TITLE:
Profile Characterization and Temperature Effect on the Wettability of Microstructured Surfaces
AUTHORS:
Yuxuan Han, Yingwei Liu, Minami Kaneko, Fumio Uchikoba
KEYWORDS:
Wetting, Microstructured Surface, Temperature Effect, Contact Angle
JOURNAL NAME:
Journal of Surface Engineered Materials and Advanced Technology,
Vol.8 No.4,
September
7,
2018
ABSTRACT: Wetting is one of the omnipresent phenomena governed via natural laws. Moreover, surface wettability at non-ambient temperature especially at high temperature (30°C to 90°C) is of great importance in many industrial processes. In this study, Si wafers with various structures were fabricated to investigate wettability at different temperatures. Three shapes with micro-pillar structured surfaces were designed and fabricated. Pillar-structured surfaces were fabricated by photolithography and ICP etching. The temperature-dependent wettability of single-phase regime droplets was characterized using contact angle measurements. The wetting behavior of a water droplet was observed.