Article citationsMore>>
White, M.S., Kaitenbrunner, M.G., Istrokowacki, E.D., Gutnichenko, K., Kettlgruber, G., Graz, I., Aazou, S., Ulbricht, C., Egbe, D.A.M., Miron, M.C., Major, Z., Schaber, M.C., Sekitani, T., Someya, T., Bauer, S. and Sariciftci, N.S. (2013) Ultrathin Highly Flexible and Stretchable PLEDs. Nature Photonics, 7, 811-816.
https://doi.org/10.1038/nphoton.2013.188
has been cited by the following article:
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TITLE:
Formation and Gas Barrier Characteristics of Polysilazane-Derived Silica Coatings Formed by Excimer Light Irradiation on PET Films with Vacuum Evaporated Silica Coatings
AUTHORS:
Tomoji Ohishi, Yoshimi Yamazaki
KEYWORDS:
Polysilazane, Photo-Irradiation, Excimer Light, Gas Barrier Characteristics, PET Film, Flexible Electronics
JOURNAL NAME:
Materials Sciences and Applications,
Vol.8 No.1,
December
28,
2016
ABSTRACT: The effects of excimer light irradiation on polysilazane coatings formed on PET films with vacuum-evaporated SiO2 coatings and the effects of these coatings on gas barrier characteristics have been investigated. The temperature during light irradiation has a large effect on the coating’s molecular structure and gas barrier characteristics. When irradiation was performed at 100℃, the polysilazane coating transformed into a silica coating, and a compact silica coating at a much lower temperature than with heat treatment alone was produced. Surface irregularities in the vapor-deposited silica coating were smoothed out by the formation of a polysilazane coating, which was transformed into a compact silica coating when irradiated with light, resulting in a significant improvement in the gas barrier characteristics. The water vapor permeability of the thin coating irradiated with excimer light at 100℃ showed only 0.04 g/m2•day (40℃, 90% RH). According to the results of investigation of temperature variation of water-vapor permeability, it is inferred that the developed film has an excellent gas barrier value, namely, 4.90 × 10–4 g/m2•day at 25℃. This gas barrier coated PET film is transparent and flexible, and can be used in the fabrication of flexible electronics. Also, the proposed fabrication method effectively provides a simple low-cost and low-temperature fabrication technique without the need for high vacuum facility.
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