TITLE:
Optimization of Thermal Aware VLSI Non-Slicing Floorplanning Using Hybrid Particle Swarm Optimization Algorithm-Harmony Search Algorithm
AUTHORS:
Sivaranjani Paramasivam, Senthilkumar Athappan, Eswari Devi Natrajan, Maheswaran Shanmugam
KEYWORDS:
VLSI Non-Slicing Floorplan, Modified Corner List (MCL) Algorithm, Hybrid Particle Swarm Optimization-Harmony Search Algorithm (HPSOHS)
JOURNAL NAME:
Circuits and Systems,
Vol.7 No.5,
April
29,
2016
ABSTRACT: Floorplanning is a prominent area in the Very
Large-Scale Integrated (VLSI) circuit design automation, because it influences
the performance, size, yield and reliability of the VLSI chips. It is the
process of estimating the positions and shapes of the modules. A high packing
density, small feature size and high clock frequency make the Integrated
Circuit (IC) to dissipate large amount of heat. So, in this paper, a
methodology is presented to distribute the temperature of the module on the
layout while simultaneously optimizing the total area and wirelength by using a
hybrid Particle Swarm Optimization-Harmony Search (HPSOHS) algorithm. This
hybrid algorithm employs diversification technique (PSO) to obtain global optima
and intensification strategy (HS) to achieve the best
solution at the local level and Modified Corner List algorithm (MCL) for
floorplan representation. A thermal modelling tool called hotspot tool is
integrated with the proposed algorithm to obtain the temperature at the block
level. The proposed algorithm is illustrated using Microelectronics Centre of
North Carolina (MCNC) benchmark circuits. The results obtained are compared
with the solutions derived from other stochastic algorithms and the proposed algorithm
provides better solution.