A Top-Down Approach of Making Sn-3.5Ag Nanosolder Alloy by Swirl Method
Hsin Jen Pan, Chao Yang Lin, Jung Hua Chou, Udit Surya Mohanty, Yuan Gee Lee
DOI: 10.4236/msa.2011.29175   PDF    HTML     4,391 Downloads   7,756 Views   Citations


The nanoparticles of tin-silver solder, Sn-3.5Ag, of necklace geometry were made in a swirl batch. It was found that the addition of the element, Ag, did not vary the microstructure of the solder matrix, but Ag simply diluted into the Sn matrix randomly. The swirl flow facilitated the formation of particles with different sizes. It was found that the size distribution of the nanoparticles was strongly related to the height in the swirl batch. In addition, the aggregation of the nanoparticles was explored and the dispersion of the nanoparticles was achieved by adjusting the pH value of the solution near the neutral value.

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H. Pan, C. Lin, J. Chou, U. Mohanty and Y. Lee, "A Top-Down Approach of Making Sn-3.5Ag Nanosolder Alloy by Swirl Method," Materials Sciences and Applications, Vol. 2 No. 9, 2011, pp. 1298-1301. doi: 10.4236/msa.2011.29175.

Conflicts of Interest

The authors declare no conflicts of interest.


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