Nanosensitive Silicon Microprobes for Mechanical Detection and Measurements


Nanosensitive mechanical microprobes with CMOS transistors, inverters, inverters cascades and ring oscillators, integrated on the thin silicon cantilevers are presented. Mechanical stress shifts linear, steep switching fragment of the inverters’ electrical characteristics. Microprobes were fabricated with use of the standard CMOS technology (3.5 μm design rules, one level polysilicon gate and one level of the metal interconnections) and relief MEMS technique. Control of the silicon cantilever thickness was satisfactory in the range above the few micrometers. Several computer simulations were done to analyze and optimize transistors location on the cantilever, in respect to the mechanical stress distribution. Results of the microprobes electromechanical tests confirm high deflection sensitivity 1.2 - 1.8 mV/nm and force sensitivity 2.0 - 2.4 mV/nN, both in nano ranges. Microprobes, with the ring oscillators revealed sensitivities 5 - 8 Hz/nm. These microprobes seem to be appropriate for applications in precise chemical and biochemical sensing.

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J. Łysko, P. Dumania, P. Janus, M. Grodner, H. Kłos, K. Skwara and P. Grabiec, "Nanosensitive Silicon Microprobes for Mechanical Detection and Measurements," Materials Sciences and Applications, Vol. 2 No. 6, 2011, pp. 582-591. doi: 10.4236/msa.2011.26078.

Conflicts of Interest

The authors declare no conflicts of interest.


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