Wave Processes and Mass Transfer on the Copper-Stainless Steel Interface under Solid Phase Bonding by High-Temperature Rolling - Open Journal of Metal

OJMetal > Vol.8 No.4, December 2018

Volume 8, Issue 4 (December 2018)

ISSN Print: 2164-2761 ISSN Online: 2164-277X

Wave Processes and Mass Transfer on the Copper-Stainless Steel Interface under Solid Phase Bonding by High-Temperature Rolling ()

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DOI: 10.4236/ojmetal.2018.84005 689 Downloads 1,377 Views Citations

Author(s)

Boris V. Borts, Aleksander A. Parkhomenko, Igor O. Vorobyov, Alexander A. Lopata

Affiliation(s)

National Science Center, Kharkov Institute of Physics & Technology, Kharkov, Ukraine.

ABSTRACT

The paper presents the study of hierarchy of deformation wave-processes from nano- to macro-structural level, which takes place in dissimilar materials, bonded by high-temperature vacuum rolling in solid phase. The focus was on the processes that occur on the interface of the bonded materials: mass trasfer of impurities and alloying elements stimulated by deformation, the study of nano- and micro-hardness.

KEYWORDS

Vacuum Hot Rolling, Solid Phase, Interface, Cupper-Stainless Steel, Microscopy, Micro-Hardness, Nano-Hardness, Wave Processes, Scaling

Share and Cite:

Borts, B. , Parkhomenko, A. , Vorobyov, I. and Lopata, A. (2018) Wave Processes and Mass Transfer on the Copper-Stainless Steel Interface under Solid Phase Bonding by High-Temperature Rolling. Open Journal of Metal, 8, 67-74. doi: 10.4236/ojmetal.2018.84005.

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