Surgical Science

Volume 2, Issue 1 (January 2011)

ISSN Print: 2157-9407   ISSN Online: 2157-9415

Google-based Impact Factor: 0.10  Citations  h5-index & Ranking

Evaluation of Stress Strain Patterns in a Stentless Aortic Valve and Its Leaflets

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DOI: 10.4236/ss.2011.21007    5,975 Downloads   9,438 Views  Citations

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ABSTRACT

Objective: To design a new trileaflet aortic valve and investigate its mechanical behavior using finite ele- ment methods. Background: Quantification of aortic valve deformation during cardiac cycle is essential in understanding normal and pathological valvular function and eventually in the design of valves. We have designed and analyzed a new tissue valve model to investigate the mechanics of the valve and its components. Methods: Steps involves in 3D CAD based geometric modeling of a trileaflet aortic valve and the effects of different component dimensions on the mechanical behavior of valve is presented in this paper. Conceptual designing of individual components was used to build the total geometric model. Different physiological pressures were applied on the valve model and its deformation patterns were studied. Results: A new geometric model of a trileaflet aortic valve was designed. Its mechanical behavior was studied. Geometric analysis and simulation of these models enhanced the designer to optimize the geometry suitable for performance during and after implantation. Conclusion: The geometry-based model presented here allows determining quickly if the new set of valve component dimensions results in a functional valve. This is of great interest to designers of new prosthetic heart valve models, as well as to surgeons involved in valve- sparing surgery.

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G. Kumar and L. Mathew, "Evaluation of Stress Strain Patterns in a Stentless Aortic Valve and Its Leaflets," Surgical Science, Vol. 2 No. 1, 2011, pp. 25-30. doi: 10.4236/ss.2011.21007.

Cited by

[1] Mechanical analysis of mechanical aortic heart valve: Trileaflet versus bileaflet
Biomedical Engineering International Conference (BMEiCON), 2013 6th. IEEE, 2013

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