SF6 Byproducts in High-Humidity Environment: an Experimental Evaluation between 200oC and 500oC

Journal of Electromagnetic Analysis and Applications

ISSN Print: 1942-0730
ISSN Online: 1942-0749
www.scirp.org/journal/jemaa
E-mail: jemaa@scirp.org

Citations

"SF₆ Byproducts in High-Humidity Environment: an Experimental Evaluation between 200^oC and 500^oC"
written by Yu Wang, Li Li, Weijian Yao,
published by Journal of Electromagnetic Analysis and Applications, Vol.3 No.6, 2011

has been cited by the following article(s):

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[3]	Study of spatial and temporal evolution of Ar and F atoms in SF6/Ar microsecond pulsed discharge by optical emission spectroscopy
	2019

[4]	Towards automated statistical partial discharge source classification using pattern recognition techniques
	High Voltage, 2018

[5]	Condition monitoring and diagnosis of power equipment: review and prospective
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[6]	Chemical by-Product Diagnostic Technique for Gas Insulated Switchgear Condition Monitoring
	2017

[7]	Status Review on Gas Insulated Switchgear Partial Discharge Diagnostic Technique for Preventive Maintenance
	2017

[8]	Decomposition characteristics of SF6 under overheating conditions
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[9]	Sulphur hexafluoride gas decomposition products of fixed metallic defect in coaxial gas insulated switchgear
	2017

[10]	Comparison of the effect of fixed metallic defects in coaxial gas insulated switchgear condition monitoring
	2017

[11]	Chemical byproduct diagnostic technique for gas insulated switchgear condition monitoring
	2017

[12]	Development of a suitcase time‐of‐flight mass spectrometer for in situ fault diagnosis of SF6‐insulated switchgear by detection of decomposition products
	Rapid communications in mass spectrometry, 2016

[13]	基于 ANSYS 分析的典型 500kV 电流互感器电场分布计算
	2014

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[1]	Experimental Measurements of Diffusion Coefficients of the CO2–SF6 Tracer System under Oceanic Sequestration Conditions Journal of Chemical & Engineering Data, 2025 DOI:10.1021/acs.jced.5c00030

[2]	Decomposition characteristics of SF6 under overheating conditions IEEE Transactions on Dielectrics and Electrical Insulation, 2017 DOI:10.1109/TDEI.2017.006572