|
[1]
|
A Review: Effect of Nanoparticle Additions on the Physical, Microstructural, Interfacial and Mechanical Properties of Low Temperature SnBi Solder Alloys
JOM,
2025
DOI:10.1007/s11837-025-07201-9
|
|
|
|
|
[2]
|
Sn–Bi–Ag Solder Enriched with Ta2O5 Nanoparticles for Flexible Mini-LED Microelectronic Packaging
ACS Applied Nano Materials,
2024
DOI:10.1021/acsanm.3c04209
|
|
|
|
|
[3]
|
Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
2023
DOI:10.1109/ECTC51909.2023.00148
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|
|
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|
[4]
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Effects of Ge addition on the growth of interfacial Ni3Sn4 IMC in the Sn58Bi/Ni solder joint: First-principles and Experimental Investigations
2023 24th International Conference on Electronic Packaging Technology (ICEPT),
2023
DOI:10.1109/ICEPT59018.2023.10492030
|
|
|
|
|
[5]
|
Effects of Ge addition on the growth of interfacial Ni3Sn4 IMC in the Sn58Bi/Ni solder joint: First-principles and Experimental Investigations
2023 24th International Conference on Electronic Packaging Technology (ICEPT),
2023
DOI:10.1109/ICEPT59018.2023.10492030
|
|
|
|
|
[6]
|
Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
2023
DOI:10.1109/ECTC51909.2023.00148
|
|
|
|
|
[7]
|
Bi-Sb-Sn Ternary Phase Diagram Evaluation
MSI Eureka,
2021
DOI:10.7121/msi-eureka-10.19333.1.6
|
|
|
|
|
[8]
|
Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
Metals,
2021
DOI:10.3390/met11020364
|
|
|
|
|
[9]
|
Causality between metal prices: Is joint consumption a more important determinant than joint production of main and by-product metals?
Resources Policy,
2019
DOI:10.1016/j.resourpol.2019.01.010
|
|
|
|
|
[10]
|
Effects of Sb and Zn Addition on Mechanical Properties and Corrosion Resistance of Sn–Ag–Cu Solders
Key Engineering Materials,
2017
DOI:10.4028/www.scientific.net/KEM.728.129
|
|
|
|
|
[11]
|
Corrosion reliability of lead-free solder systems used in electronics
2017 40th International Spring Seminar on Electronics Technology (ISSE),
2017
DOI:10.1109/ISSE.2017.8000929
|
|
|
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