A spatiotemporal signal processing technique for wafer-scale IC thermomechanical stress monitoring by an infrared camera

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ISSN Print: 2327-5081
ISSN Online: 2327-509X
www.scirp.org/journal/jbm
E-mail: jbm@scirp.org

"A spatiotemporal signal processing technique for wafer-scale IC thermomechanical stress monitoring by an infrared camera"
written by Michel Saydé, Ahmed Lakhssassi, Emmanuel Kengne, Roman Palenichka,
published by Journal of Biosciences and Medicines, Vol.1 No.2, 2013

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