Electronic Circuit Failure Detection Using Thermal Image

Journals Menu

Follow SCIRP

	customer@scirp.org
	+86 18163351462(WhatsApp)
	1655362766

	Paper Publishing WeChat

Open Access Library Journal

ISSN Print: 2333-9705
ISSN Online: 2333-9721
www.scirp.org/journal/oalibj
E-mail: service@oalib.com

Google-based Impact Factor: 1.18
Citations

Journals Menu

"Electronic Circuit Failure Detection Using Thermal Image"
written by Azrul Mahfurdz, Rohaizan Saher, Wan Ghani Wan Pi,
published by Open Access Library Journal, Vol.7 No.8, 2020

has been cited by the following article(s):

Google Scholar
CrossRef

[1]	Decoupling and Reconstruction of Low-quality Temperature Fields of Printed Circuit Boards
	IEEE Sensors Journal, 2024

[2]	A Survey of PCB Defect Detection Algorithms
	Journal of Electronic Testing, 2023

[3]	Termografía infrarroja pasiva aplicada a sistemas de detección de fallas: Una revisión
	Digital Ciencia@ UAQRO, 2021

[1]	Decoupling and Reconstruction of Low-Quality Temperature Fields of Printed Circuit Boards IEEE Sensors Journal, 2024 DOI:10.1109/JSEN.2024.3365875

[2]	Decoupling and Reconstruction of Low-Quality Temperature Fields of Printed Circuit Boards IEEE Sensors Journal, 2024 DOI:10.1109/JSEN.2024.3365875

[3]	Enhancing busbar safety: a smart thermal imaging pipeline for real-time load monitoring Nondestructive Testing and Evaluation, 2024 DOI:10.1080/10589759.2024.2436114

Follow SCIRP

	customer@scirp.org
	+86 18163351462(WhatsApp)
	1655362766

	Paper Publishing WeChat

Open Access Library Journal

Open Access Library Journal

Journals Menu

Home

About SCIRP

Service

Policies