"Evaluation of Fatigue Life of Semiconductor Power Device by Power Cycle Test and Thermal Cycle Test Using Finite Element Analysis"
written by Kazunori Shinohara, Qiang Yu,
published by Engineering, Vol.2 No.12, 2010
has been cited by the following article(s):
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[1] Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip
[2] FE analysis the effect of bonding wire and solder failure on the resistance and temperature of IGBT
[3] Vieillissement accéléré de modules de puissance de type MOSFET SiC et IGBT Si basé sur l'analyse de profils de mission d'onduleurs photovoltaïques.
Thèse, 2018
[4] Mission profile-based accelerated ageing tests Of SiC MOSFET And Si IGBT Power Modules In DC/AC Photovoltaic Inverters
Thesis, 2018
[5] Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure
Microelectronics Reliability, 2018
[6] Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations
Microelectronics Reliability, 2018
[7] 수치해석을 이용한 전동차용 IGBT 모듈의 피로 수명 예측
[8] Numerical Fatigue Life Prediction of IGBT Module for Electronic Locomotive
[9] Predicting LED System Life: A Long-term Study of the Factors that Determine Performance and Failure
[10] Electro-thermal and thermal-mechanical FE analysis of IGBT module with different bonding wire shape
[11] Projecting LED product life based on application
[12] Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bonding
Journal of Power Electronics, to be Published, 2016
[13] Power Cycling Reliability of Power Module: A Survey
IEEE Transactions on Device and Materials Reliability, 2016
[14] Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings
Advances in Manufacturing, Springer, 2014
[15] A Probabilistic Approach for Reliability and Life Prediction of Electronics in Drilling and Evaluation Tools
Kale, Amit A., Katrina Carter-Journet, Troy A. Falgout, Ludger Heuermann-Kuehn, and Derick Zurcher., 2014
[16] パワー半導体モジュールのマルチフィジックスシミュレーション
大同大学紀要= Bulletin of Daido University, 2013
[17] アイテムリスト
[18] Thermo-elastic-plastic analysis for elastic component under high temperature fatigue crack growth rate
ProQuest Dissertations Publishing, 2013
[19] Thermo-elastic-plastic analysis for elastic component under high temperature fatigue crack growth rate.