TEM Observation of Si0.99C0.01 Thin Films with Arsenic-Ion-, Boron-Ion-, and Silicon-Ion-Implantation Followed by Rapid Thermal Annealing

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DOI: 10.4236/msce.2017.51003    3,406 Downloads   4,130 Views  

ABSTRACT

Strained Si and its related materials, such as strained SiGe and strained silicon-carbon alloy (Si-C), are receiving tremendous interest due to their high carrier mobility. In this study we carry out a basic investigation of the change in microstructure of ion-implanted Si-C solid solution caused by rapid thermal annealing, because it is very important to realize a field-effect transistor made of this new material. The microstructures of arsenic-ion-, boron-ion-, and silicon-ion-implanted Si0.99C0.01 specimens upon thermal annealing are observed using transmission electron microscopy, and it is revealed that the rate of solid-state crystallization of ion-implanted Si-C is slower than that of the ion-implanted Si.

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Yamanaka, J. , Inoue, S. , Arimoto, K. , Nakagawa, K. , Sawano, K. , Shiraki, Y. , Moriya, A. , Inokuchi, Y. and Kunii, Y. (2017) TEM Observation of Si0.99C0.01 Thin Films with Arsenic-Ion-, Boron-Ion-, and Silicon-Ion-Implantation Followed by Rapid Thermal Annealing. Journal of Materials Science and Chemical Engineering, 5, 15-25. doi: 10.4236/msce.2017.51003.

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