Special Issue on Thin Film Materials and Its Applications
Thin films
are important because they offer the potential for low-cost processing with
minimal material usage while fulfilling application requirements. Importantly,
this can enable cost-effective applications for expensive raw source materials.
Thin films also can enable applications where low weight and mechanical
flexibility are crucial. The
goal of this special issue is to provide a platform for scientists and academicians all over the world to promote, share, and
discuss various new issues and developments in the area of thin film materials and its applications.
In this special issue, we intend to invite
front-line researchers and authors to submit original research and review articles
on exploring thin film materials and its applications. Potential topics include, but are not limited to:
-
Film deposition methods
-
Ceramic thin films
-
Structural control of compound thin films
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Modes of film growth by vapor deposition
-
Film microstructures
-
Processing of microelectronic structures
-
Film stress and substrate curvature
-
Thin Film materials and devices
-
Thin film processes
-
Thin films as material engineering
Authors should read over the journal’s For Authors carefully
before submission. Prospective authors should submit an electronic copy of
their complete manuscript through the journal’s Paper Submission System.
Please kindly specify the “Special Issue”
under your manuscript title. The research field “Special Issue - Thin
Film Materials and Its Applications” should be selected during your
submission.
Special Issue Timetable:
Submission Deadline
|
March 6th, 2024
|
Publication Date
|
May 2024
|
Guest
Editor:
For further
questions or inquiries,
please contact
Editorial Assistant at
ampc@scirp.org.