Biography

Prof. Bruce C. Kim

City University of New York, USA

Professor


Email: bkim@ccny.cuny.edu, bruce.kim@ieee.org


Qualifications

1996 Ph.D., Georgia Institute of Technology, Electrical Engineering

1985 M.Sc., University of Arizona, Electrical Engineering

1981 B.Sc., University of California, Irvine, Electrical Engineering


Publications (selected)

  1. Kim, B., Gupta, A., Thambiraj, S., Lee, J. H., & Park, J. W. (2023, December). Functionalized ZnO Nanowires for Biosensing Applications. In 2023 IEEE 16th International Conference on Nano/Molecular Medicine & Engineering (NANOMED) (pp. 214-217). IEEE.
  2. Kim, B., Aleem, M., Kundu, S., & Park, J. (2023, July). Developing nanosensors with silicon nanowires. In 2023 IEEE 23rd International Conference on Nanotechnology (NANO) (pp. 1066-1069). IEEE.
  3. Kim, B., Gupta, A., & Spryn, M. (2020, September). Wireless Sensor Platform for Nanosensor Interface Electronics. In International Symposium on Microelectronics (Vol. 2020, No. 1, pp. 000090-000093). International Microelectronics Assembly and Packaging Society.
  4. Kim, B. C., & Gupta, A. (2017, July). Device synthesis topology for zinc oxide nanowire sensors. In 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO) (pp. 626-629). IEEE.
  5. A. Gupta, B. Kim, R. Kasim, “Synergistic Utilization of MEMS Array Topology and Nanosensor Package for Trace Multiple Analyte Detection”Journal of Advanced Materials Research,volume 774-776, pp. 1503-1507, DOI: 10.4028/www.scientific.net/AMR.774-776.1503, January 2014.
  6. A. Gupta, B. Kim, R. Kasim, “Novel MEMS switch topology and nanosensor package for multi-analyte chemical detection” Advanced Materials Research, vol. 774, pp. 1503-1507, 2013.
  7. S. Evana, B. Kim, “Design and self-calibration scheme for RF circuits using MEMS in 3D packages,” LAP LAMBERT Academic Publishing.
  8. A. Gupta, B. Kim, “A Blended E-Learning Model for a Higher Education Framework,” Journal of Advanced Education and Management, DEStech Publications.
  9. S. Kannan,K. Kannan, B. Kim, F. Taenzler, R. Antley, K. Moushegian, K. Butler, D. Mirizzi, “Physics-Based Low-Cost Test Technique for High Voltage LDMOS,”Journal of Electronic Testing: Theory and Applications, Vol.29, No. 6, pp. 745-762, DOI: 10.1007/s10836-013-5147-5, December, 2013.
  10. A. Gupta, B. Kim, E. Edwards, C. Brantley, P. Ruffin, “Synthesis and Functionalization Study ofHierarchical ZnO Nanowires for Potential Nitroaromatic Sensing Applications”Applied Physics A,vol.107, pp. 709-714, 2012.
  11. A. Gupta, B. Kim, E. Edwards, C. Brantley, P. Ruffin, “Functionalization of ZnO nanowires for potentialp-nitrophenol sensing applications,”Advanced Materials Research, Vol. 567, pp. 228-231, 2012.
  12. A. Gupta, B. Kim, E. Edwards, C. Brantley, P. Ruffin, “ Design of Nanosensing platform based on Zinc Oxide nanowire arrays,”Journal of Smart Nanosystems in Engineering and Medicine, GINTEM, ISSN: 2167-5813, Editor: Vijay Varadan, September 2012.
  13. S. Kannan, B. Kim, A. Gupta, S.K. Noh, L. Li, “Characterization of High Performance CNT-based TSV for High Frequency RF Applications,”Techno Press: International Journal of Advances in Materials Research, Vol. 1, Num. 1, pp. 37-49, March 2012.
  14. S. Kannan, B. Kim, B. Ahn, “Fault Modeling and Multi-tone Dither Scheme for Testing 3-D Through Silicon Via Defects,”Springer: Journal of Electronic Testing Theory and Applications– Special Issue in 3D Testing, Vol. 28, Num. 1, pp. 39-51, 2012.
  15. S. Kannan, B. Kim, N. Sai Evana, S.H. Noh, “System-on-Chip Integrated MEMS Packages for RF LNA Testing and Self Calibration,”IMAPS Journal of Microelectronics and Electronic Packaging, Vol. 8, Num. 4, pp. 154-163, 2012.
  16. A. Gupta, B. Kim, E. Edwards, C. Brantley, P. Ruffin, “ Synthesis and Functionalization Study of Hierarchical ZnO Nanowires for Potential Nitroaromatic Sensing Applications”,Springer: Applied Physics A, Materials Science & Processing, Vol. 107, No.3, pp. 709-714, March 2012.
  17. A. Gupta, B. Kim, C. Watkins, S. Street, E. Edwards, C. Brantley, P. Ruffin, “Surface Chemistry for ZnO Nanowires for Nanosensor Applications,” Transactions of the ASME,Journal of Nanotechnology in Engineering and Medicine, Vol.2, pp.011010-1-4, February 2011.
  18. S. Kannan, B. Kim, G. Srinivasan, F. Taenzler, R. Antley, C. Force, “Embedded RF Circuit Diagnostic Technique with Multi-Tone Dither Scheme,”SpringerJournal of Electronic Testing Theory and Applications,Special Issue in Analog, Mixed Signal and RF Testing, Vol. 27, Number 3,pp.241-252,2011.
  19. B. Kim, R. Kasim, “Development of MEMS Power Sensor Package,”IMAPS Journal of Microelectronics and Electronic Packaging, Vol. 7, No. 3, pp. 169-174, 2011.
  20. B. Kim, S. Kannan, A. Gupta, F. Mohammed. B. Ahn, “Development of Carbon Nanotube Based Through Silicon Vias,” Transactions of the ASME,Journal of Nanotechnology in Engineering and Medicine, Vol. 1, pp.121-128, May 2010.
  21. B. Kim, H. Zhu, J. He, “Integrated Double Sided Neural Sensor with Dry Etch BCB”, Transactions of the ASME,Journal of Nanotechnology in Engineering and Medicine, Vol. 1, pp.021010-1-4, May 2010.
  22. B. Kim, “Novel Design of Carbon Nanotube Based RF Inductors,” Transactions of the ASME,Journal of Nanotechnology in Engineering and Medicine, Vol. 1, pp.011003-1-4,February 2010.
  23. Bruce C. Kim, Craig Force, "Guest Editors' Introduction: The Evolution of RFIC Design and Test,"IEEE Design and Test of Computers, vol. 25, no.1, pp. 6-8, January-February, 2008.
  24. G. Kim, R. L. Martens, G. B. Thompson, B. C. Kim, and A. Gupta, “Selective area synthesis of magnesium oxide nanowires,”Journal of Applied Physics,102, pp.104906-1 to 5, November 2007.
  25. H. Zhu, J. He, B. Kim, “Processing and Characterization of Dry-Etch Benzocyclobutene Dielectrics as Substrate and Packaging Material for Neural Sensors,”IEEE Transactions on Components and Packaging Technologies, Volume 30, Number 3, pp. 390-396, September 2007.
  26. J.Y. Ryu, B.C. Kim, I. Sylla, “A Novel RF Test Scheme Based on a DFT Method,”Journal of Electronic Testing Theory and Applications,Volume 22, Number 3, pp.229-237, June 2006.
  27. J.H. Jang, N. Ishitobi, B.C. Kim, and S.G. Jeong, “Effects of Microstructural Defects in Multilayer LTCC Stripline,”IEEE Transactions on Advanced Packaging, Volume 29, Number 2, pp. 314-319, May 2006.
  28. Bruce C. Kim, Yervant Zorian, "Guest Editors' Introduction: Big Innovations in Small Packages,"IEEE Design and Test of Computers, vol.23, no.3, pp. 186-187, May/Jun, 2006.
  29. J.Y. Ryu, B.C. Kim, I. Sylla, “A Novel Low-Cost RF Built-In Self-Test measurement for System-on-Chip Transceivers,”IEEE Transactions on Instrumentation and Measurement, Volume 55, Number 2, pp. 381 – 388, April 2006.
  30. J.Y. Ryu, B.C. Kim, “Low-Cost Testing of 5 GHz Low Noise Amplifiers Using New RF BIST Circuit,”Journal of Electronic Testing Theory and Applications,Volume 21, Number 6, pp. 571 – 581, December 2005.


Profile Details

https://www.ccny.cuny.edu/profiles/bruce-kim?srsltid=AfmBOoqfMjIxgGg1zWOczZskzShdiejFaYmY8gE_heMwswJOlJ31SYPx
https://scholar.google.com/citations?user=R1E6xTMAAAAJ&hl=en
https://www.scholarena.com/eb/295/Bruce-C-Kim-Journal-of-Nanoscience-and-Nanotechnology-Applications
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