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Electroplating: Applications in the Semiconductor Industry
(Articles)
Jivaan Kishore Jhothiraman
,
Rajesh Balachandran
Advances in Chemical Engineering and Science
Vol.9 No.2
，April 30, 2019
DOI:
10.4236/aces.2019.92018
2,375
Downloads
10,484
Views
Citations
Simplified Model of a Layer of Interconnects under a Spiral Inductor
(Articles)
Sonia M. Holik
,
Timothy D. Drysdale
Journal of Electromagnetic Analysis and Applications
Vol.3 No.6
，June 23, 2011
DOI:
10.4236/jemaa.2011.36031
7,517
Downloads
11,806
Views
Citations
Quasi-Dynamic Green’s Functions for Efficient Full-Wave Integral Formulations for Microstrip Interconnects
(Articles)
Andrea G. Chiariello
,
Antonio Maffucci
Journal of Electromagnetic Analysis and Applications
Vol.4 No.2
，February 29, 2012
DOI:
10.4236/jemaa.2012.42009
5,608
Downloads
8,641
Views
Citations
Syntheses of Doped-LaCrO
3
Nanopowders by Hydrothermal Method
(Articles)
Minkyung Kang
,
Juyeon Yun
,
Chiwook Cho
,
Changyoon Kim
,
Weonpil Tai
Open Journal of Inorganic Non-metallic Materials
Vol.3 No.3
，July 15, 2013
DOI:
10.4236/ojinm.2013.33007
3,890
Downloads
7,688
Views
Citations
Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules
(Articles)
Rick Sturdivant
,
Astacian Bogdon
,
Edwin K. P. Chong
Journal of Electronics Cooling and Thermal Control
Vol.7 No.1
，January 18, 2017
DOI:
10.4236/jectc.2017.71001
2,283
Downloads
4,415
Views
Citations
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