Wire Bonding Using Offline Programming Method

Yeong Lee Foo, Ah Heng You, Chee Wen Chin

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DOI: 10.4236/eng.2010.28086                

Abstract

Manual process of creating bonding diagram is known to be time consuming and error prone. In comparison, offline programming (OLP) provides a much more viable option to reduce the wire bonding creation time and error. OLP is available in two versions, i.e., vendor specific OLP and direct integration offline pro- gramming (Di-OLP). Both versions utilize the bonding diagram and computer aided design data to speed up bonding program creation. However, the newly proposed Di-OLP is more flexible as it can be used to create bonding program for multiple machine platforms in microelectronics industry. Some special features of Di-OLP method are presented. The application of generic OLP however, is applicable to machines that recognize ASCII text file. The user needs to know the data format accepted by machine and convert the data accordingly to suit its application for different machine platforms. Di-OLP is also a practical method to replace the time consuming manual method in production line.

Keywords

Wire Bonding, Offline Programming, Computer Aided Design, Direct Integration Offline Programming, Bondlist

Conflicts of Interest

The authors declare no conflicts of interest.

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