Open Journal of Composite Materials

Vol.7 No.2(2017), Paper ID 75919, 12 pages

DOI:10.4236/ojcm.2017.72007

 

Scanning Electron Microscopy (SEM) Analysis and Hardness of Diffusion Bonded Titanium-Titanium and Titanium-Copper Plates with Static Force and without Interlayers

 

Joel Hemanth

 

Department of Mechanical Engineering, H.M.S. Institute of Technology, Tumkur, India

 

Copyright © 2017 Joel Hemanth et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

How to Cite this Article

Hemanth, J. (2017) Scanning Electron Microscopy (SEM) Analysis and Hardness of Diffusion Bonded Titanium-Titanium and Titanium-Copper Plates with Static Force and without Interlayers. Open Journal of Composite Materials, 7, 105-116. doi: 10.4236/ojcm.2017.72007.
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