Open Journal of Applied Sciences

Vol.9 No.5(2019), Paper ID 92400, 12 pages

DOI:10.4236/ojapps.2019.95028

 

Microstructure and Strength of Diffusion Bonded 2014 AA Alloys Using Copper Interlayer

 

Abass Ali Saleh

 

Department of Materials Engineering, College of Engineering, Mustansiriyah University, Baghdad, Iraq

 

Copyright © 2019 Abass Ali Saleh et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

How to Cite this Article

Saleh, A. (2019) Microstructure and Strength of Diffusion Bonded 2014 AA Alloys Using Copper Interlayer. Open Journal of Applied Sciences, 9, 342-353. doi: 10.4236/ojapps.2019.95028.
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