Open Journal of Business and Management

Open Journal of Business and Management

ISSN Print: 2329-3284
ISSN Online: 2329-3292
www.scirp.org/journal/ojbm
E-mail: ojbm@scirp.org
"Emerging Business Trends in the Microelectronics Industry"
written by Samar K. Saha,
published by Open Journal of Business and Management, Vol.4 No.1, 2016
has been cited by the following article(s):
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[3] Development focus of electronics industry in Russia: Shift from defense sector to market
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[6] A detailed roadmap from conventional‐MOSFET to nanowire‐MOSFET
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[7] A Study on Emergence of Cryptocurrency in the Modern World
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[8] Current Drifts in Business and Finance
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[9] A composable design space exploration framework to optimize behavioral locking
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[10] Supporting Collaborative Innovation Processes in Smart Product Value Creation Networks
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[11] Comparative Analysis of the Development Status of Integrated Circuit Trade between China and South Korea
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[12] ТРАНСФОРМАЦИЯ БИЗНЕС-МОДЕЛЕЙ ЭЛЕКТРОНИКИ: ОТ IDM К ЭКОСИСТЕМАМ
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[13] The Impact of Technological Capability on Financial Performance in the Semiconductor Industry. Sustainability 2021, 13, 489
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[14] The Impact of Technological Capability on Financial Performance in the Semiconductor Industry
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[15] Composable Heuristics for Register-Transfer Level Logic Locking Optimization
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[16] Lead scratch resolution through wirebonding process optimization on qfn packages
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[17] FinFET Devices for VLSI Circuits and Systems
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[18] A Study of Die Shear Test Performance on Different Diebond Machine Platforms
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[19] Leadframe Design Enhancement for Elimination of Burrs at Singulation Process
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[20] Ball Misplace Mitigation through Process Optimization of Advanced Leadframe Package
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[21] Elimination of Smashed Ball Defect through Process and Design Improvement
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[22] Die Attach Machine Selection for Glue Voids Reduction Performance
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[23] Die Attach Film Bleed out Resolution through Process Optimization on DFN Packages
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[24] Process Optimization to Eliminate Automatic Alignment Failures on the Scalable Device
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[25] Addressing Package Voids on Extremely Small Leadframe Device
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[26] Resolution of Damaged Metallization on Highly Complex Semiconductor Device
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[27] The poetics of one's testimony
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[28] Die Attach Process Defect Mitigation through Design Improvement on Anvil Block Tooling
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[29] Pick and Place Process Defect Mitigation on Semiconductor BGA Device
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[30] Transitioning Semiconductor Companies Enabling Smart Environments and Integrated Ecosystems
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[31] Advances in Business and Management
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[32] Fabless Semiconductor Firms' Financial Performance Determinant Factors: Product Platform Efficiency and Technological Capability
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[33] Circuit Obfuscation and Oracle-guided Attacks: Who can Prevail?
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[34] Cost-Benefit Analysis of Computer-Aided Technology Customization Projects
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[35] Nanotechnology for Microelectronics and Photonics
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[36] CYBER SUPPLY CHAIN SECURITY: CAN THE BACKDOOR BE CLOSED WITH TRUSTED DESIGN, MANUFACTURING AND SUPPLY
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[37] AU/ACSC/2016
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