Mita, M., Kajihara, M., Kurokawa, N. and Sakamoto, K. (2005) Growth Behavior of Ni3Sn4 Layer during Reactive Diffusion between Ni and Sn at Solid-State Temperatures. Journal of Material Science and Engineering A, 403, 269-275.
http://dx.doi.org/10.1016/j.msea.2005.05.012

has been cited by the following article:

• TITLE: Investigation of the Influence of Annealing Temperature on the Morphology and Growth Kinetic of Ni3Sn4 in the Ni-Sn-Solder System

  AUTHORS: Mathias Wendt, Andreas Plöβl, Andreas Weimar, Marcus Zenger, Klaus Dilger

  KEYWORDS: Lead-Free Solders, Intermetallic Compound Formation, Grain Growth, Coarsening, Solid Liquid Inter-Diffusion (SLID) Bonding

  JOURNAL NAME: Journal of Materials Science and Chemical Engineering, Vol.4 No.2, February 29, 2016

  ABSTRACT: The reaction between high purity nickel (99.999%) and high purity tin (99.999%) was investigated in the temperature range of 232℃ - 330℃, at short periods of annealing (1 - 60 s). The reaction kinetic was studied using cross-sectional scanning electron microscope (SEM) images. The intermetallic compound (IMC) growth was analyzed using the empirical power law and a time dependence in the range of 0.26 to 0.33 was found. The morphology of the IMC was investigated by SEM in the temperature range of 235℃ - 290℃, at annealing periods of 10 s, 30 s, and 60 s by selectively etching away the remaining elementary tin. The exposed IMC displays a change in morphology with increasing annealing temperature, demonstrating that the growth velocity of certain crystallographic orientations of the IMC is strongly influenced by the annealing temperature. Additionally, coarsening and crumbling of the IMC grains is observed, and will be discussed with respect to the responsible mechanisms.