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Miyaki, M., Kanai, M. and Ogata, S. (1999) Soldering Properties for Lead-Free Solders of Sn-Ag-Cu System Solders. Proceedings of the Third IEMT/IMC Symposium (International Electronic Manufacturing Symposium and the International Microelectronics Conference), Omiya, 21-23 April 1999, 125-130.

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