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Kim, S.I., Lee, K.H., Mun, H.A., Kim, H.S., Hwang, S.W., Roh, J.W., Yang, D.J., Shin, W.H., Li, X.S., Lee, Y.H., Snyder, G.J. and Kim, S.W. (2015) Dense Dislocation Arrays Embedded in Grain Boundaries for High-Performance Bulk Thermoelectrics. Science, 348, 109-114.
https://doi.org/10.1126/science.aaa4166

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