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has been cited by the following article:

• TITLE: Thermal Modeling of Thermosyphon Integrated Heat Sink for CPU Cooling

  AUTHORS: A. Shanmuga Sundaram, Anirudh Bhaskaran

  KEYWORDS: Thermosyphon, Heat Sink, Effectiveness, Conventional Cooling Method

  JOURNAL NAME: Journal of Electronics Cooling and Thermal Control, Vol.1 No.2, September 30, 2011

  ABSTRACT: A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling. An Indirect cooling module has been experimentally studied and analyzed under steady state condition for both natural and forced convection. The thermal model is employed to determine the actual heat transfer and the effectiveness of the present model and compared it with the conventional cooling method and found that there is an appreciable improvement in the present model.