TITLE:
Stress Intensity Factors in Two Bonded Elastic Layers Containing Crack Perpendicular on the Interface with Different Elastic Properties
AUTHORS:
Mahdi Keikhaie, Nasser Keikhaie, Reza Keikhaie, Mohammad Mahdi Kaykha
KEYWORDS:
Thin Film, Channeling Crack, Infinite Element, SIF
JOURNAL NAME:
Journal of Modern Physics,
Vol.6 No.5,
April
21,
2015
ABSTRACT: Thin
bonded films have many applications (i.e.
in information storage and processing systems, and etc.). In many cases, thin
bonded films are in a state of residual tension, which can lead to film
cracking and crack extension in one layer often accompanies failure in whole
systems. In this paper, we analyze a channel crack advanced throughout
thickness of an elastic thin film bonded to a dissimilar semi-infinite
substrate material via finite element method (FEM). In order to simplify
modeling, the problem is idealized as plane strain and a two-dimensional model
of a film bonded to an elastic substrate is proposed for simulating channel
crack in thin elastic film. Film is modeled by common 4-node and substrate by
infinite 4-node meshes. The stress intensity factor (SIF) for cracked thin film
has been obtained as a function of elastic mismatch between the substrate and
the film. The results indicate that in elastic mismatch state, SIF is more than
match state. On the other hand, mismatch state is more sensitive to crack than
match state. And SIF has also increased by increasing Young’s modulus and
Poisson ratio of film.