Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H. and Islam, M.N. (2006) Effect of Adding 1 wt% Bi into the Sn-2.8Ag-0.5Cu Solder Alloy on the Intermetallic Formations with Cu-Substrate during Soldering and Isothermal Aging. Journal of Alloys and Compounds, 407, 208.
http://dx.doi.org/10.1016/j.jallcom.2005.06.050

has been cited by the following article:

• TITLE: Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys

  AUTHORS: M. A. Wadud, M. A. Gafur, M. R. Qadir, M. O. Rahman

  KEYWORDS: Lead Free Solder Alloy, Eutectic Alloy, DTA, TMA, Conductivity

  JOURNAL NAME: Materials Sciences and Applications, Vol.6 No.11, November 20, 2015

  ABSTRACT: Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work, eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their thermal and electrical properties. Thermo-mechanical Analysis and Differential Thermal Analysis were used to investigate thermal properties. Microstructural study is carried out with Scanning Electron Microscope. The alloys have single melting point. The co-efficient of thermal expansion and co-efficient of thermal contraction varies with alloy composition and temperature range. Electrical conductivity changes with Bi addition.