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Tanner, B.K., Wittge, J., Vagovic, P., Baumbach, T., Allen, D., McNally, P.J., Bytheway, R., Jacques, D., Fossati, M.C., Bowen, D.K., Garagorri, J., Elizalde, M.R. and Danilewsky, A.N. (2013) X-Ray Diffraction Imaging for Predictive Metrology of Crack Propagation in 450-mm Diameter Silicon Wafers. Powder Diffraction, 28, 95-99.
http://dx.doi.org/10.1017/S0885715613000122

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