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J.-H. Huang, Y.-L. Dong, Y. Wan, X.-K. Zhao and H. Zhang, “Investigation on Reactive Diffusion Bonding of SiCp/6063 MMC by Using Mixed Pow-ders as Interlayers,” Journal of Materials Processing Technol-ogy, Vol. 190, No. 1-3, 2007, pp. 312-316. doi:10.1016/j.jmatprotec.2007.02.028

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