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G. Li, Y. Shi, H. Hao, Z. Xia, Y. Lei, F. Guo and X. Li, “Effect of Rare Earth Addition on Shear Strength of SnAgCu Lead-Free Solder Joints,” Journal of Materials Science: Materials in Electronics, Vol. 20, No. 2, 2009, pp. 186-192. doi:10.1007/s10854-008-9696-z

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