Article citationsMore>>
Deligianni, H., Dukovic, J.O., Andricacos, P.C. and Walton, E.G. (1999) Electrochemical Processing in ULSI Fabrication and Semiconductor/Metal Deposition II. In: Andricacos, P.C., Searson, P.C., Reidsema-Simposon, C., Allongue, P., Stickney, J.L. and Oleszek, G.M., Eds., ULSI Fabrication and Semiconductor/Metal Deposition II, PV 99-9, The Electrochemical Society Proceedings Series, Pennington, NJ, 52.
has been cited by the following article:
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TITLE:
Electroplating: Applications in the Semiconductor Industry
AUTHORS:
Jivaan Kishore Jhothiraman, Rajesh Balachandran
KEYWORDS:
Electroplating, Copper, Interconnects, Modeling
JOURNAL NAME:
Advances in Chemical Engineering and Science,
Vol.9 No.2,
April
30,
2019
ABSTRACT: There is a lot of research that has been done on electroplating of metals depending on the type of application. In this chapter, the importance of this technique to the semiconductor industry is discussed in detail from an experimental as well as a modeling standpoint. In particular, the effect of solution variables i.e. chloride, accelerator, suppressor on copper electrodeposition is discussed. This knowledge is applied to achieve a defect-free, bottom-up metal/copper fill that eventually, is one of the most critical processes in this billion-dollar industry.
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