TITLE:
Review of the Global Trend of Interconnect Reliability for Integrated Circuit
AUTHORS:
Qian Lin, Haifeng Wu, Guoqing Jia
KEYWORDS:
Integrated Circuit, Interconnect Reliability, Interconnect Modeling, Interconnect Process
JOURNAL NAME:
Circuits and Systems,
Vol.9 No.2,
February
8,
2018
ABSTRACT: Interconnect reliability has been regarded as a discipline that must be seriously taken into account from the early design phase of integrated circuit (IC). In order to study the status and trend of the interconnect reliability, a comprehensive review of the published literatures is carried out. This can depict the global trend of ICs’ interconnect reliability and help the new entrants to understand the present situation of this area.